• JK Magnesium Die-Casting Materials

    Greater weight reduction with reliable performance

    Built for lightweight and thermal-critical applications

  • Table#4 HTCM-1 vs. AZ91D Magnesium Alloy Comparison(23℃)

  • High Thermal Conductivity Magnesium Alloy Applications

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    Laptop Bottom Cover

    (Lenovo ThinkPad T14 D Cover)

    Avg. thickness: 0.8 mm

    Projected area: 220 × 330 mm

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    Laptop Keyboard Cover

    (Lenovo ThinkPad T14 C Cover)

    Avg. thickness: 0.9 mm

    Minimum thickness: 0.6 mm

    Projected area: 260 × 350 mm

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    Ultra-Thin Laptop Keyboard Cover

    (Lenovo FX390 C Cover)

    Avg. thickness: 0.7 mm

    Minimum thickness: 0.45 mm

    Projected area: 180 × 250 mm

  • High Thermal Conductivity Magnesium Alloy Applications

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    Consumer electronics

    Laptop housings, Smartphone mid-frames, Automotive electronics heat sinks

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    Lighting & display

    LED display back panels, LED heat sinks

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    5G infrastructure

    Base station heat sinks, Filters

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    1、Raw Material