JK Magnesium Die-Casting Materials
➣ Greater weight reduction with reliable performance
➣ Built for lightweight and thermal-critical applications

Table#4 HTCM-1 vs. AZ91D Magnesium Alloy Comparison(23℃)


High Thermal Conductivity Magnesium Alloy Applications

Laptop Bottom Cover
( D Cover)
Avg. thickness: 0.8 mm
Projected area: 220 × 330 mm

Laptop Keyboard Cover
( C Cover)
Avg. thickness: 0.9 mm
Minimum thickness: 0.6 mm
Projected area: 260 × 350 mm

Ultra-Thin Laptop Keyboard Cover
( C Cover)
Avg. thickness: 0.7 mm
Minimum thickness: 0.45 mm
Projected area: 180 × 250 mm
High Thermal Conductivity Magnesium Alloy Applications

Consumer electronics
Laptop housings, Smartphone mid-frames, Automotive electronics heat sinks

Lighting & display
LED display back panels, LED heat sinks

5G infrastructure
Base station heat sinks, Filters

Process 1.
Raw Material
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Process 2.
Melting
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Process 3.
Forming
→

Process 4.
Gate Removal
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Process 5.
Deburring
→

Process 6.
CNC
→

Process 7.
Pre-Treatment
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Process 8.
Surface Treatment
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Process 9.
Packaging and Shipment
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